Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.
I have a question about the book:
‘CFD Analysis of Heat Transfer problems - Srinivasa Rao, Chepuri’.
Fill in the form below.
We will respond as fast as possible.
