Stochastic Finite Element Modeling in Electronic Packaging

Chu, Liu (Tongji University

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€ 100,15
Gebonden
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Writer
Chu, Liu (Tongji University
Title
Stochastic Finite Element Modeling in Electronic Packaging
Publisher
John Wiley & Sons Inc
Year
2026
Language
English
Pages
288
EAN
9781394352944
Binding format
Gebonden

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