Boekstra - Lau, John - 3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John

Lau, John - 3D IC Integration and Packaging

Lau, John - 3D IC Integration and Packaging

Description

A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications

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Writer: Lau, John
Title: 3D IC Integration and Packaging
Publisher: McGraw-Hill Education - Europe

Year: 2015
Language: English
Pages: 480
Weight: 419 gr

EAN: 9780071848060
Dimensions: 210 x 150 x 22 mm
Binding format: Hardback

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Categories

Food and drinks

Regional novels